SAC305 T3 soldering powder

SAC305 T3 soldering powder is the world's most widespread Lead-free standard alloy for electronics production. With the composition Sn 96.5 %, Ag 3 %, Cu 0.5 % it combines excellent wetting, mechanical stability and process reliability. The melting range is approx. 217-220 °C. Due to the T3 grit (25-45 µm) it is ideal for reproducible stencil printing and reliable reflow processes.

Properties and advantages

• International standard: SAC305 is the world's most widely used lead-free solder for SMT applications.
• High solder joint strength: Reliable performance under temperature cycles and mechanical stress.
• T3 grit: Good balance between printability, paste rheology and even distribution.
• Very good wetting: Homogeneous, clean solder joints even on complex assemblies.
• Lead-free & RoHS compliant: Sustainable solution for modern electronics production.

Areas of application

SMT and reflow soldering

SAC305 T3 is a Standard for SMT and reflow processes in the Semiconductor Technology & Electronics. It enables reproducible results in automated production steps.

Fine-Pitch & BGA

With its T3 grain size, SAC305 is suitable for Fine-pitch printed circuit boards and for BGA and µBGA componentsthat require high precision.

Automotive industry & electrical engineering

In the Automotive industry and Electrical engineering SAC305 is used when assemblies have to withstand vibrations and strong temperature cycles.

Hard & soft soldering

Also in the area of Hard & soft soldering SAC305 is used when lead-free processes with a clearly defined melting range are required.

Technical properties

• Composition: Sn 96.5 %, Ag 3 %, Cu 0.5 %
• Melting range: approx. 217-220 °C
• Grain size: T3 (25-45 µm)
• Particle morphology: Spherical for stable paste rheology
• Purity: Controlled quality with low oxidation tendency

Sustainability & regulation

As Lead-free solder SAC305 fulfils the RoHS specifications and is an internationally established standard in electronics production. It supports energy-efficient production processes and reduces reject rates.

Conclusion

SAC305 T3 soldering powder is the world's leading standard solder for SMT and reflow. With its proven composition, T3 grain size and high process reliability, it is suitable for fine-pitch, BGA and industrial applications. Further fields of application can be found in the Semiconductor Technology & Electronics and in the Hard & soft soldering.