SAC305 T4 soldering powder

SAC305 T4 soldering powder is the fine-grained variant of the globally proven SAC305-Lots. With the composition Sn 96.5 %, Ag 3 %, Cu 0.5 % it offers reliable solder joints, high strength and thermal stability. The melting range is approx. 217-220 °C. The T4 grit (20-38 µm) makes the powder ideal for fine-pitch, micro-BGA and high-density SMT applications where precision is critical.

Properties and advantages

• Proven SAC305 alloy: International standard for lead-free SMT and reflow processes.
• Fine T4 grit: Higher print resolution and clean paste rheology for fine-pitch designs.
• Stable solder joints: Resistant to temperature cycles and mechanical stress.
• Very good wettability: Homogeneous solder joints even with demanding layouts.
• Lead-free & RoHS compliant: Sustainable solution for modern electronics production.

Areas of application

Fine-Pitch & Micro-BGA

Thanks to its fine grain, SAC305 T4 is particularly suitable for High-density printed circuit boardsfine-pitch structures and BGA/µBGA components in the Semiconductor Technology & Electronics.

SMT and reflow soldering

In automated SMT and reflow processes SAC305 T4 ensures clean stencil prints and reproducible results for complex assemblies.

Automotive industry & electrical engineering

In the Automotive industry and the Electrical engineering SAC305 T4 is used when durable, fine-grained solder joints are required.

Hard & soft soldering

Also for applications in the Hard & soft soldering SAC305 T4 is suitable when lead-free processes with fine paste application are required.

Technical properties

• Composition: Sn 96.5 %, Ag 3 %, Cu 0.5 %
• Melting range: approx. 217-220 °C
• Grain size: T4 (20-38 µm)
• Particle morphology: Spherical for even paste distribution
• Purity: High quality, controlled oxidation

Sustainability & regulation

SAC305 is lead-free and fulfils the RoHS directives. The fine grain makes it particularly suitable for energy-efficient processes and reduces reject rates in high-precision applications.

Conclusion

SAC305 T4 soldering powder is the ideal choice for fine-pitch, micro-BGA and demanding SMT applications. With its fine grain, proven alloy and lead-free design, it stands for reliability and precision. Further fields of application can be found in the Semiconductor Technology & Electronics and in the Hard & soft soldering.