Sn97Cu3 T3 solder powder

Sn97Cu3 T3 solder powder is a lead-free, silver-free Tin-copper solder with 97 % Tin and 3 % Copper. It combines economical material costs with robust performance in series production. With a defined melting point around approx. 227 °C and the T3 grit (25-45 µm) Sn97Cu3 is suitable for precise stencil printing, reliable reflow soldering and long-lasting solder joints in standard SMT processes.

Properties and advantages

• Silver-free & economical: Cost-efficient alternative to SAC alloys with stable process performance.
• Robust solder joints: The copper content supports strength, thermal conductivity and cycle resistance.
• T3 grit (25-45 µm): Balanced paste rheology for clean print images and reproducible reflow results.
• Good wetting: Homogeneous, even solder joints even on complex PCB layouts.
• Lead-free & RoHS compliant: Sustainable solution for modern electronics production.

Areas of application

SMT and reflow processes

In the Semiconductor Technology & Electronics Sn97Cu3 T3 is used as a silver-free standard solution when the focus is on cost-optimised, stable solder joints.

Fine pitch & standard layouts

The T3 grit is suitable for fine-pitch structures in the usual SMT window as well as for dense standard layouts with reproducible paste placement.

Automotive industry & electrical engineering

In the Automotive industry and the Electrical engineering Sn97Cu3 is used in assemblies that Temperature changes and Vibrations have to withstand permanently.

Hard & soft soldering

For defined, lead-free processes in the Hard & soft soldering Sn97Cu3 offers reliable wetting and a stable microstructure without the addition of silver.

Technical properties

• Composition: Sn 97 %, Cu 3 %
• Melting point: approx. 227 °C
• Grain size: T3 (25-45 µm)
• Particle morphology: Predominantly spherical for even paste distribution
• Purity: Controlled quality with low oxidation tendency

Sustainability & regulation

Unleaded and RoHS-compliantSn97Cu3 T3 supports environmentally friendly manufacturing processes and reduces material costs by dispensing with silver.

Conclusion

Sn97Cu3 T3 solder powder is the silver-free, robust choice for SMT and reflow applications with a focus on cost-effectiveness and durability. With a T3 grain size, defined melting point and good wettability, it impresses in series production. You can find more fields of application in the Semiconductor Technology & Electronics and in the Hard & soft soldering.