Sn62Pb36Ag2 T4 solder powder

The Sn62Pb36Ag2 T4 solder powder is a classic tin-lead-silver solder that is characterised by its Silver content of 2 % and the fine grain size T4. With a melting point of approx. 179 °C, it is ideal for high-precision soldering processes, particularly in the production of Hard & soft soldering and for the production of sophisticated solder pastes.

Properties and advantages

• Silver-reinforced alloy: The 2 % Ag content increases the strength and durability of soldered joints.
• Fine grain T4: Ideal for high-resolution PCB layouts, fine-pitch components and BGA connections.
• Constant melting point (~179 °C): Ensures homogeneous results and reliable solder joints.
• Very good wettability: Ensures even, clean and reliable solder joints.
• Process stability: Ideal for automated reflow and SMT processes.

Areas of application

Printed circuit board production (semiconductor technology & electronics)

The powder is often used in the Semiconductor Technology & Electronics where high precision and mechanical strength of the solder joints are crucial.

SMD and BGA assembly

The fine T4 grain size makes Sn62Pb36Ag2 particularly suitable for Fine-pitch components and BGA/µBGA applicationsthat require precise solder pastes.

Hard & soft soldering

Also in the area of Hard & soft soldering this soldering powder impresses with its controlled flow and wetting behaviour.

Automotive industry & electrical engineering

In the Automotive industry and the Electrical engineering Sn62Pb36Ag2 T4 is used for electronic assemblies that have to function reliably under high mechanical and thermal loads.

Technical properties

• Composition: Sn 62 %, Pb 36 %, Ag 2 %
• Melting point: approx. 179 °C
• Grain size: T4 (20-38 µm)
• Particle structure: Spherical for even distribution
• Purity: Controlled quality to minimise oxidation

Sustainability & regulation

Despite RoHS restrictions, leaded solders such as Sn62Pb36Ag2 T4 are still indispensable in certain high-tech areas. These include, for example Aerospace or specialised pyrotechnical applications in which the unique material properties are decisive.

Conclusion

Sn62Pb36Ag2 T4 solder powder combines the proven stability of tin-lead solder with the reinforcing properties of silver. Its fine grain makes it the ideal choice for high-resolution printed circuit boards, fine-pitch components and applications with the highest quality requirements. Further fields of application can be found in the following areas Semiconductor Technology & Electronics and Hard & soft soldering.