SnCu0.6Ni0.05Ge T4 solder powder

The SnCu0.6Ni0.05Ge T4 solder powder is a silver-free, lead-free special solder on the basis of Tin-copper. With 0.6 % Copper, 0.05 % Nickel and a Germanium additive it offers an improved microstructure, reduces oxidation and increases process stability. The T4 grit (20-38 µm) enables high-precision stencil printing and is particularly suitable for Fine-pitch and micro-BGA layouts. The melting point is approx. 227 °C.

Properties and advantages

• Nickel additive: Stabilises the microstructure and reduces copper dissolution during soldering.
• Germanium as an antioxidant: Reduces oxide formation, improves flow properties and extends paste shelf life.
• Fine T4 grit: Ideal for High-density PCB layouts with small stencil openings.
• Silver-free & economical: Cost-effective alternative to SAC alloys with comparable performance.
• Lead-free & RoHS compliant: Sustainable and environmentally friendly solution for SMT processes.

Areas of application

Fine-Pitch & Micro-BGA

The fine T4 grain makes SnCu0.6Ni0.05Ge particularly suitable for Fine pitch designsmicro-BGA and other high-precision structures in the Semiconductor Technology & Electronics.

SMT and reflow processes

In automated SMT and reflow applications the powder ensures clean paste rheology, defined print images and long-lasting solder joints.

Automotive industry & electrical engineering

In the Automotive industry and the Electrical engineering the alloy is used when robust, lead-free and at the same time silver-free soldered joints are required.

Hard & soft soldering

Also in the area of Hard & soft soldering SnCu0.6Ni0.05Ge T4 impresses with its defined melting properties and stable joining technology.

Technical properties

• Composition: Sn ~99.35 %, Cu 0.6 %, Ni 0.05 %, Ge Trace element
• Melting point: approx. 227 °C
• Grain size: T4 (20-38 µm)
• Particle morphology: Spherical, low oxidation
• Purity: High quality, low oxidation tendency

Sustainability & regulation

SnCu0.6Ni0.05Ge T4 is lead-free, silver-free and fulfils the RoHS directives. It enables energy-efficient soldering processes with low oxidation and contributes to sustainable production.

Conclusion

SnCu0.6Ni0.05Ge T4 solder powder is the fine variant of the SCNG alloy. With nickel and germanium additives, T4 grain size and lead-free composition, it offers high process stability and precision for fine-pitch, SMT and micro-BGA. Further fields of application can be found in the Semiconductor Technology & Electronics and in the Hard & soft soldering.