Sn43Bi57 T3 solder powder

The Sn43Bi57 T3 solder powder is a lead-free tin-bismuth alloy with a melting point of approx. 139 °C. Due to the increased Tin content (43 %) Compared to Sn42Bi58, it offers slightly improved wettability and mechanical stability, while at the same time protecting temperature-sensitive components. With a T3 grit (25-45 µm) it is ideal for precise stencil printing and reproducible reflow processes.

Properties and advantages

• Low melting point (~139 °C): Protects temperature-sensitive components and reduces thermal loads.
• Increased tin content: Better wetting and improved stability of the solder joints compared to Sn42Bi58.
• T3 grit: Clean paste deposit, stable printing results and controlled wetting.
• Lead-free & RoHS compliant: Sustainable solution for modern electronics production.
• Cost efficiency: Attractive alternative to silver solders with a clearly defined melting profile.

Areas of application

Temperature-sensitive electronics

Particularly suitable for Semiconductor Technology & ElectronicsLEDs, sensors or displays, for example, which cannot tolerate high soldering temperatures.

SMT & reflow processes

The T3 grit enables precise stencil application of solder pastes and ensures reliable solder joints in automated reflow soldering processes.

Hard & soft soldering

Also in the area of Hard & soft soldering Sn43Bi57 is used when reproducible results at a defined melting point are required.

Automotive industry & electrical engineering

In the Automotive industry and Electrical engineering the powder is used in assemblies that have to be processed gently but still require durable solder joints.

Technical properties

• Composition: Sn 43 %, Bi 57 %
• Melting point: approx. 139 °C
• Grain size: T3 (25-45 µm)
• Particle morphology: Spherical for even distribution
• Purity: controlled quality, low oxidation

Sustainability & regulation

As Lead-free solder Sn43Bi57 fulfils the RoHS requirements and supports sustainable production processes. The low melting point also reduces energy consumption in reflow processes.

Conclusion

Sn43Bi57 T3 solder powder is the ideal solution for temperature-sensitive applications. With a low melting point, increased wettability and precise T3 grain size, it combines process reliability with sustainability. Further fields of application can be found in the following areas Semiconductor Technology & Electronics and Hard & soft soldering.