Sn96.5Ag3Cu0.5 15-25 µm Solder powder

Sn96.5Ag3Cu0.5 15-25 µm is a specially classified variant of the globally established SAC305-Lots. With 96.5 % Tin, 3 % Silver and 0.5 % Copper it combines the reliability of this standard alloy with a very narrow particle size distribution of 15-25 µm. This specialisation enables extremely precise paste applications and is suitable for highly integrated assemblies, fine-pitch structures and micro BGAs.

Properties and advantages

• Defined particle size: 15-25 µm for maximum control in stencil printing and dispensing processes.
• High precision: Minimises bridging and improves the quality of the finest structures.
• SAC305 standard: Proven combination of mechanical stability and thermal resistance.
• Very good wetting: Ensures homogeneous, durable solder joints even with miniature layouts.
• Lead-free & RoHS compliant: Sustainable solution for modern electronics production.

Areas of application

Micro-BGA & CSP

With its fine particle size, this powder is ideal for Micro-BGA, Chip Scale Packages (CSP) and other high-precision assemblies that require defined paste deposits. The main area of application is Semiconductor Technology & Electronics.

Fine pitch layouts

Sn96.5Ag3Cu0.5 15-25 µm is used in Fine pitch structures to ensure clean solder paste application and reliable solder joints.

SMT and reflow processes

In SMT and reflow soldering the defined grain size guarantees reproducible results and maximum process reliability, even with high-density assemblies.

Automotive industry & electrical engineering

In the Automotive industry and Electrical engineering the powder is used when miniaturisation, reliability and high thermal resistance come together.

Technical properties

• Composition: Sn 96.5 %, Ag 3 %, Cu 0.5 %
• Melting range: approx. 217-220 °C
• Grain size: 15-25 µm (narrowly classified)
• Particle morphology: Spherical for stable paste rheology
• Purity: Controlled quality, low oxidation tendency

Sustainability & regulation

These SAC305 special variant fulfils the RoHS requirements and supports precise, energy-efficient production processes thanks to its fine grain size. It therefore contributes to lower reject rates and sustainable electronics production.

Conclusion

Sn96.5Ag3Cu0.5 15-25 µm Solder powder is the high-end solution for applications that require maximum precision. With its narrow particle size distribution, it offers maximum process reliability in fine-pitch, micro-BGA and high-density SMT layouts. Further fields of application can be found in the following areas Semiconductor Technology & Electronics and in the Hard & soft soldering.