Sn95Sb0.5 T4 solder powder

The Sn95Sb0.5 T4 solder powder is a lead-free Tin-antimony solder with 95 % Tin and 0.5 % Antimony. The low antimony content improves the mechanical strength and temperature resistance of the solder joints. With a melting range of approx. 232-240 °C and the fine T4 grit (20-38 µm) it is suitable for Precise stencil prints and high-density SMT applications.

Properties and advantages

• Antimony reinforced (0.5 %): Higher strength and improved resistance to thermal loads.
• Fine T4 grit: Ideal for fine-pitch layouts, micro BGA and high-resolution stencil printing.
• Stable melting range: Approx. 232-240 °C for reproducible soldering processes.
• Very good wettability: Clean and homogeneous solder joints with a stable microstructure.
• Lead-free & RoHS compliant: Sustainable alternative to classic tin-lead solders.

Areas of application

Fine-pitch & high-density layouts

Thanks to the fine T4 grain size, Sn95Sb0.5 is suitable for Fine pitch designsmicro-BGA and other high-precision SMT applications in the Semiconductor Technology & Electronics.

SMT and reflow soldering

In automated SMT and reflow processes the powder ensures precise paste rheology and stable, repeatable results.

Automotive industry & electrical engineering

In the Automotive industry and Electrical engineering Sn95Sb0.5 T4 is used for assemblies that High mechanical loads and Temperature cycles have to endure.

Hard & soft soldering

Also in the area of Hard & soft soldering the alloy is used when lead-free processes with increased stability are required.

Technical properties

• Composition: Sn 95 %, Sb 0.5 %
• Melting range: approx. 232-240 °C
• Grain size: T4 (20-38 µm)
• Particle morphology: Spherical for uniform paste rheology
• Purity: High material quality, low oxidation tendency

Sustainability & regulation

Sn95Sb0.5 T4 is lead-free and fulfils the RoHS directives. Thanks to its fine grain size, it enables energy-efficient production processes and helps to reduce reject rates.

Conclusion

Sn95Sb0.5 T4 solder powder is the fine-grained version of the lead-free tin-antimony solder. With improved mechanical behaviour, defined T4 grain size and sustainable composition, it offers a reliable solution for demanding fine-pitch and SMT applications. Further fields of application can be found in the Semiconductor Technology & Electronics and in the Hard & soft soldering.