SAC405 T3 is a lead-free solder powder with 4 % silver. It offers improved wetting, high strength and reliable results in SMT and reflow processes.
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SAC405 T3 soldering powder is a proven SAC alloy with 95.5 % Tin, 4 % Silver and 0.5 % Copper. The higher silver content compared to SAC305 improves the Wettability and the Strength of the solder joints. With a melting range of approx. 217-220 °C, the alloy is suitable for Sophisticated SMT and reflow processes. The T3 grit (25-45 µm) ensures clean stencil prints and stable paste rheology.
SAC405 T3 is often used in the Semiconductor Technology & Electronics used. The increased silver content results in stable solder joints with improved wetting in SMT and reflow applications.
The T3 grit is suitable for Fine-pitch printed circuit boards and BGA and µBGA componentsthat require robust connections.
In the Automotive industry and Electrical engineering SAC405 is used when assemblies have to withstand high thermal loads.
Also for lead-free Hard & soft soldering processes SAC405 is suitable when stable and precise results are required.
As Lead-free solder SAC405 fulfils the RoHS specifications and is established in many industries. Thanks to the combination of a higher silver content and T3 grain size, it offers long-lasting, environmentally friendly solder joints.
SAC405 T3 soldering powder is the ideal choice for applications that benefit from improved wetting and increased stability. With 4 % silver content, lead-free composition and T3 grain size, it is a reliable standard solder for modern electronics. Further fields of application can be found in the Semiconductor Technology & Electronics and in the Hard & soft soldering.
Contact us for individual advice or our customer service on weekdays from 09:00 to 16:00.
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Contact us for individual advice or our customer service on weekdays from 09:00 to 16:00.