SAC 405 T4 soldering powder

The SAC405 T4 soldering powder is the fine variant of the proven SAC405 alloy. With 95.5 % Tin, 4 % Silver and 0.5 % Copper it offers improved wettability and increased strength compared to SAC305. The melting range is approx. 217-220 °C. Thanks to the T4 grit (20-38 µm) it is particularly suitable for High-resolution layouts, fine-pitch designs and micro-BGA applications.

Properties and advantages

• Increased silver content (4 %): Improves wetting, solder joint stability and electrical conductivity.
• Fine T4 grit: Ideal for fine-pitch structures and high-precision SMT applications.
• Stable performance: High resistance to temperature cycles and mechanical loads.
• Very good wettability: Clean, homogeneous solder joints even with complex layouts.
• Lead-free & RoHS compliant: Sustainable solution for modern electronics production.

Areas of application

Fine-Pitch & Micro-BGA

With its T4 grit SAC405 is ideal for high-density layoutsfine pitch structures and BGA and µBGA components that require precise paste rheology. The main area of application is Semiconductor Technology & Electronics.

SMT and reflow processes

In automated SMT and reflow soldering SAC405 T4 impresses with reproducible performance, high wettability and defined melting profiles.

Automotive industry & electrical engineering

In the Automotive industry and Electrical engineering the alloy is used when assemblies have to withstand temperature cycles and vibrations over the long term.

Hard & soft soldering

Also in the Hard & soft soldering SAC405 T4 is used when fine structures and lead-free processes are required.

Technical properties

• Composition: Sn 95.5 %, Ag 4 %, Cu 0.5 %
• Melting range: approx. 217-220 °C
• Grain size: T4 (20-38 µm)
• Particle morphology: Spherical for even paste distribution
• Purity: High quality, low oxidation tendency

Sustainability & regulation

SAC405 is lead-free and fulfils the RoHS directives. With its fine grain and higher silver content, it supports energy-efficient production processes and durable assemblies.

Conclusion

SAC405 T4 soldering powder is the fine-grain variant of the popular SAC405 alloy. With 4 % silver, fine grain size and high process reliability, it is the right choice for fine-pitch, micro-BGA and high-precision SMT applications. Further fields of application can be found in the Semiconductor Technology & Electronics and in the Hard & soft soldering.