Sn0.5Pb92.5Ag2.5 T3 solder powder

The Sn0.5Pb92.5Ag2.5 T3 solder powder is a special lead-containing solder with a particularly high Lead content of 92.5 %. Supplemented with 0.5 % tin and 2.5 % silver, it offers an exceptional combination of high mechanical strength, temperature resistance and good electrical conductivity. With a grain size of T3 (25-45 µm), it is ideally suited for reproducible results in Hard & soft soldering and in specialised electronics applications.

Properties and advantages

• High lead content: Provides excellent heat and stress resistance.
• Silver reinforcement (2.5 % Ag): Increases the strength and stability of the solder joints.
• T3 grit (25-45 µm): Precise processing and uniform solder pastes possible.
• Optimised flow behaviour: Clean, reliable and durable soldered connections.
• Good electrical conductivity: Suitable for highly stressed electronic assemblies.

Areas of application

Electronics production

The powder is used in the Semiconductor Technology & Electronics especially in assemblies that have to function reliably under high thermal and mechanical loads.

Hard & soft soldering

In the area Hard & soft soldering the alloy ensures precise, homogeneous solder joints with high resistance to temperature cycles.

Automotive industry & electrical engineering

In the Automotive industry and the Electrical engineering Sn0.5Pb92.5Ag2.5 T3 is used when assemblies have to withstand high thermal loads or vibrations.

Specialised applications

Thanks to its high resistance to stress cracking and thermal cycling, this soldering powder is also suitable for Pyrotechnic applications and other security-relevant processes where stability is the top priority.

Technical properties

• Composition: Sn 0.5 %, Pb 92.5 %, Ag 2.5 %
• Melting range: approx. 300-305 °C
• Grain size: T3 (25-45 µm)
• Particle structure: Predominantly spherical
• Purity: Controlled quality to minimise oxidation

Sustainability & regulation

Due to the high lead content, this alloy is subject to strict regulatory restrictions (e.g. RoHS). Nevertheless, Sn0.5Pb92.5Ag2.5 T3 remains indispensable in certain high-tech areas - for example in the Aerospace or in pyrotechnical special applications.

Conclusion

Sn0.5Pb92.5Ag2.5 T3 solder powder offers a unique combination of high strength, temperature resistance and electrical conductivity. With its fine T3 grain size, it is ideal for demanding electronic applications that require maximum reliability. Further possible applications can be found in the following areas Semiconductor Technology & Electronics and Hard & soft soldering.