Sn10Pb88Ag2 T3 solder powder

Sn10Pb88Ag2 T3 solder powder is a classic lead-containing alloy with 10 % Tin, 88 % Lead and 2 % Silver. The high lead content ensures an increased melting range of approx. 268-300 °C, making it ideal for High temperature applications is suitable. The added silver improves the wettability and strength of the solder joints, while the T3 grit (25-45 µm) ensures clean stencil prints and even processing.

Properties and advantages

• High melting range (~268-300 °C): Suitable for soldering that requires a high thermal load capacity.
• Silver additive (2 % Ag): Improves wetting, mechanical stability and the durability of solder joints.
• T3 grit: Ensures clean applications and reproducible results in solder pastes.
• High strength: Resistant to temperature cycles and mechanical stress.
• Proven special alloy: Used in industries that require durable and resilient solder joints.

Areas of application

High-temperature soldering

Sn10Pb88Ag2 is specially designed for High temperature applications where a wide melting range is an advantage. Especially in the Electrical engineering and in Automotive assemblies it is used where components have to be reliably connected under high thermal stress.

Hard & soft soldering

Also in the Hard & soft soldering Sn10Pb88Ag2 T3 is used when strong connections and high process reliability are required.

Power electronics

In Power electronics and modules this alloy is used for solder joints that have to withstand high currents and thermal cycles.

Special industrial applications

The powder is suitable for special processes in which a Long service life of the solder joints and safe operation at elevated temperatures are required.

Technical properties

• Composition: Sn 10 %, Pb 88 %, Ag 2 %
• Melting range: approx. 268-300 °C
• Grain size: T3 (25-45 µm)
• Particle morphology: Spherical for clean paste rheology
• Purity: Controlled quality with low oxidation tendency

Sustainability & regulation

As leaded solder Sn10Pb88Ag2 does not fall under the RoHS requirements for lead-free electronics production. It is therefore used in Special and high-temperature applications where the properties of classic tin-lead alloys are indispensable.

Conclusion

Sn10Pb88Ag2 T3 solder powder is a robust special solder with a high melting point and silver reinforcement. It offers reliable solder joints for applications that have to withstand high thermal and mechanical loads. Further fields of application can be found in the Electrical engineeringthe Automotive industry and in the Hard & soft soldering.