Sn42Bi57.6Ag0.4 T3 solder powder

Sn42Bi57.6Ag0.4 T3 solder powder is a lead-free tin-bismuth alloy with 42 % Tin, 57.6 % Bismuth and 0.4 % Silver. The low silver content improves the Wettability and the Strength of the solder joints. With a melting point of approx. 138-140 °C, the powder is particularly suitable for Temperature-sensitive componentswhere classic SAC plumb bobs would generate too high loads. The T3 grit (25-45 µm) ensures clean paste rheology and reliable results.

Properties and advantages

• Low melting point (~138-140 °C): Protects sensitive components such as LEDs, displays and sensors.
• Silver additive (0.4 %): Improves solder joint strength and reduces cracking.
• T3 grit: Optimised for stencil printing and standard SMT processes.
• Very good wettability: Ensures homogeneous, even solder joints.
• Lead-free & RoHS compliant: Sustainable alternative to leaded solders.

Areas of application

Temperature-sensitive electronics

Ideal for Semiconductor Technology & Electronicse.g. for LEDs, displays or sensors that must not be processed at high temperatures.

SMT and reflow processes

Sn42Bi57.6Ag0.4 T3 is suitable for Stencil printing and Reflow soldering optimised for applications where exact paste rheology and reproducible results are required.

Fine pitch layouts

Thanks to the T3 grain size, the powder is also suitable for Fine pitch designs suitable for applications that require stable paste applications and clean print images.

Automotive industry & electrical engineering

In the Automotive industry and Electrical engineering Sn42Bi57.6Ag0.4 T3 is used when assemblies need to be thermally protected and yet reliably soldered.

Technical properties

• Composition: Sn 42 %, Bi 57.6 %, Ag 0.4 %
• Melting point: approx. 138-140 °C
• Grain size: T3 (25-45 µm)
• Particle morphology: Spherical for even paste distribution
• Purity: High quality, low oxidation tendency

Sustainability & regulation

Sn42Bi57.6Ag0.4 T3 is lead-free and fulfils the RoHS directives. Due to its low melting point, it contributes to energy-efficient processes and reduced thermal load.

Conclusion

Sn42Bi57.6Ag0.4 T3 solder powder is the right choice for temperature-sensitive applications. With a low melting point, silver reinforcement and T3 grain size, it offers process reliability and long-lasting solder joints. Further fields of application can be found in the Semiconductor Technology & Electronics and in the Hard & soft soldering.