Sn42Bi57.6Ag0.4 T4 solder powder

Sn42Bi57.6Ag0.4 T4 solder powder is a lead-free Low temperature solder with 42 % Tin, 57.6 % Bismuth and 0.4 % Silver. The addition of silver increases the Wettability improved and the Solder joint strength increased. With a melting point of approx. 138-140 °C, it is particularly suitable for Temperature-sensitive components. The T4 grit (20-38 µm) ensures fine paste rheology and makes it ideal for high-density layouts and fine-pitch applications.

Properties and advantages

• Low melting point (~138-140 °C): Minimises thermal loads for components such as LEDs, sensors and displays.
• Silver additive (0.4 % Ag): Increases strength, reliability and wetting behaviour of the solder joints.
• Fine T4 grit: Supports precise stencil printing and clean print images with fine-pitch structures.
• Very good wetting: Homogeneous, even solder joints with high reproducibility.
• Lead-free & RoHS compliant: Sustainable solution for modern electronics production.

Areas of application

Fine-pitch & high-density layouts

With its fine grain, Sn42Bi57.6Ag0.4 T4 is ideal for Fine-pitch printed circuit boardsMicro-BGA and other high-precision applications in the Semiconductor Technology & Electronics.

SMT and reflow processes

In SMT and reflow soldering Sn42Bi57.6Ag0.4 T4 ensures precise stencil application and stable results even with complex assemblies.

Automotive industry & electrical engineering

In the Automotive industry and Electrical engineering the powder is used when Temperature-sensitive assemblies and at the same time reliable solder joints are required.

Hard & soft soldering

Also for defined processes in the Hard & soft soldering Sn42Bi57.6Ag0.4 T4 is suitable when lead-free and precise solutions are required.

Technical properties

• Composition: Sn 42 %, Bi 57.6 %, Ag 0.4 %
• Melting point: approx. 138-140 °C
• Grain size: T4 (20-38 µm)
• Particle morphology: Spherical for homogeneous paste rheology
• Purity: High quality, controlled oxidation

Sustainability & regulation

Sn42Bi57.6Ag0.4 T4 is lead-free and fulfils the RoHS directives. Thanks to its fine grain, it contributes to energy-efficient processes and reduced reject rates.

Conclusion

Sn42Bi57.6Ag0.4 T4 solder powder combines low process temperatures with fine grit and silver reinforcement. It is the right choice for high-precision fine-pitch and SMT applications. Further fields of application can be found in the Semiconductor Technology & Electronics and in the Hard & soft soldering.