Sn42Bi57Ag1 T3 solder powder

Sn42Bi57Ag1 T3 solder powder is a lead-free low-temperature alloy with 42 % Tin, 57 % Bismuth and 1 % Silver. The addition of silver improves wettability and increases the mechanical strength of the solder joints. With a melting point of approx. 138-140 °C, this powder is ideal for Temperature-sensitive componentswhere standard SAC plumb bobs would cause too high a load. The T3 grit (25-45 µm) makes it a reliable choice for SMT and reflow processes.

Properties and advantages

• Low melting point (~138-140 °C): Protects sensitive components and reduces thermal loads.
• Silver reinforcement (1 % Ag): Improves wetting, adhesion and strength of solder joints.
• T3 grit: Good printability, homogeneous paste rheology and reproducible results.
• Very good wettability: Ensures clean, even and durable solder joints.
• Lead-free & RoHS compliant: Sustainable alternative to leaded solders.

Areas of application

Temperature-sensitive electronics

Particularly suitable for Semiconductor Technology & Electronicsfor LEDs, sensors or displays, for example, which cannot be processed at high soldering temperatures.

SMT and reflow soldering

Sn42Bi57Ag1 T3 is ideal for Stencil printing and Reflow processeswhere precise paste deposition and defined melting areas are required.

Fine pitch applications

Thanks to the T3 grain size, the powder can also be used for Fine pitch designs that require stable paste rheology and clean print images.

Automotive industry & electrical engineering

In the Automotive industry and the Electrical engineering Sn42Bi57Ag1 is used for assemblies that need to be thermally protected but still require reliable solder joints.

Technical properties

• Composition: Sn 42 %, Bi 57 %, Ag 1 %
• Melting point: approx. 138-140 °C
• Grain size: T3 (25-45 µm)
• Particle morphology: Spherical for even distribution
• Purity: High quality, low oxidation tendency

Sustainability & regulation

As Lead-free solder Sn42Bi57Ag1 fulfils the RoHS requirements. Thanks to its low melting point, it enables energy-efficient reflow processes and supports sustainable production methods.

Conclusion

Sn42Bi57Ag1 T3 solder powder is the right choice for Temperature-sensitive componentsthat require reliable solder joints at low temperatures. With 1 % silver additive and fine T3 grain size, it offers an ideal combination of process reliability, wettability and mechanical stability. Further fields of application can be found in the Semiconductor Technology & Electronics and in the Hard & soft soldering.