Sn62Pb36Ag2 T3 solder powder

The Sn62Pb36Ag2 T3 solder powder is a proven material in electronics production and offers improved mechanical properties compared to classic tin-lead solders thanks to its silver content. With a eutectic melting point of approx. 179 °C, it enables precise and reliable soldering processes. The T3 grain size is ideal for Hard and soft soldering and the production of high-quality solder pastes.

Properties and advantages

• Silver-reinforced alloy: The silver content of 2 % increases the strength and improves the conductivity of the solder joints.
• Eutectic behaviour: Exact melting point at approx. 179 °C ensures uniform results without paste demixing.
• Fine grit T3: Versatile use for standard SMT processes and reflow processes.
• Reliable wetting: Good flow properties enable homogeneous, durable solder joints.

Applications of Sn62Pb36Ag2 T3

Printed circuit board production

The powder is ideal for the production of solder pastes in the Semiconductor Technology & Electronics. The silver reinforcement improves the durability of connections in highly stressed assemblies.

SMD technology (SMT)

Thanks to the T3 grain size, the powder offers a very good balance between paste printability and solder bead formation. This makes it ideal for fine-pitch and standard SMT applications.

Automotive industry & electrical engineering

In the Automotive industry and in the Electrical engineering Sn62Pb36Ag2 T3 is used for assemblies that must be particularly resistant to mechanical stress.

Technical properties (example values, customisable according to specification)

• Composition: Sn 62 %, Pb 36 %, Ag 2 %
• Melting point: 179 °C
• Grain size: T3 (25-45 µm)
• Particle structure: Spherical for optimum processing
• Purity: Controlled quality for minimal oxidation

Sustainability & regulation

Lead-containing solders such as Sn62Pb36Ag2 T3 are restricted in many standard applications by RoHS-relevant specifications. Nevertheless, they remain indispensable in certain specialised areas - for example in the Aerospacein pyrotechnical applications or in highly reliable electronic assemblies.

Conclusion

With Sn62Pb36Ag2 T3 solder powder you can rely on a high-performance material that ensures particularly stable and durable solder joints thanks to its silver content. It combines reliable processing, precise melting properties and high resistance - ideal for electronics, SMT and special applications. Rely on NMD Metal Powders for tested quality and secure supply chains.