Sn62Pb36Ag2 T5 solder powder

The Sn62Pb36Ag2 T5 solder powder combines the advantages of classic tin-lead solders with the reinforcing properties of 2 % Silver. The particularly fine T5 grit makes it the preferred choice for high-precision soldering processes in electronics production - from Hard & soft soldering to complex SMT applications.

Properties and advantages

• Silver-reinforced alloy: Increased strength and reliability of soldered joints.
• T5 grit (15-25 µm): Particularly suitable for high-resolution fine-pitch and micro-BGA layouts.
• Low melting point (~179 °C): Process reliability thanks to homogeneous melting properties.
• Very good wettability: Clean, even and durable soldered joints.
• Optimised for automation: Excellent for reflow and modern SMT processes.

Areas of application

Printed circuit board production (semiconductor technology & electronics)

In the Semiconductor Technology & Electronics Sn62Pb36Ag2 T5 is used in particular for high-density circuits. The fine grain size ensures precise solder pastes for micro-BGA and fine-pitch components.

SMD and micro BGA assembly

The very fine T5 grit is ideal for Solder pastes with the highest resolution. It enables precise paste deposition, prevents bridging and ensures reliable connections for the smallest structures.

Hard & soft soldering

Also in the area of Hard & soft soldering this soldering powder impresses with its consistent flow properties and even solder joints.

Automotive industry & electrical engineering

In the Automotive industry and the Electrical engineering Sn62Pb36Ag2 T5 is used when assemblies have to withstand high mechanical loads and thermal cycles.

Technical properties

• Composition: Sn 62 %, Pb 36 %, Ag 2 %
• Melting point: approx. 179 °C
• Grain size: T5 (15-25 µm)
• Particle structure: Spherical for precise distribution
• Purity: Controlled quality to minimise oxidation

Sustainability & regulation

Although leaded solders have been replaced by RoHS restrictions in many standard applications, they are still indispensable in specialised high-tech sectors. These include the Aerospace as well as high-precision pyrotechnical applications where defined material properties are crucial.

Conclusion

Sn62Pb36Ag2 T5 solder powder is the ideal solution for applications that require maximum precision. With its extremely fine grit, it is perfect for fine-pitch, micro-BGA and high-density electronics production. Further application information can be found in the sections Semiconductor Technology & Electronics and Hard & soft soldering.