Sn63Pb37 T4 solder powder

Sn63Pb37 T4 solder powder is a classic eutectic plumb bobconsisting of 63 % Tin and 37 % Lead. With a defined melting point of 183 °C it enables precise process control without a melting interval. The T4 grit (20-38 µm) offers an even finer paste rheology compared to T3, which is particularly useful for Fine pitch designs and high-density SMT layouts.

Properties and advantages

• Eutectic composition: Fixed melting point of 183 °C for precise temperature control.
• Fine T4 grit: Supports high-resolution PCB layouts and micro-pitch designs.
• Clean wetting: Uniform, homogeneous solder joints with high reproducibility.
• Reliability: Decades of proven standard plumb bobs for industry & electronics.
• Stable paste rheology: Optimised for stencil printing and automated processes.

Areas of application

Fine-Pitch & SMT

Thanks to the fine grain size, Sn63Pb37 T4 is particularly suitable for Fine pitch layouts and complex SMT processes in the Semiconductor Technology & Electronics.

Automotive industry

In the Automotive industry Sn63Pb37 T4 is used for control units, sensors and cable assemblies that benefit from the fine grain.

Hard & soft soldering

Also in the area of Hard & soft soldering Sn63Pb37 T4 offers stable results at moderate process temperatures.

Electrical engineering

In the Electrical engineering Sn63Pb37 T4 is convincing in applications that require clean, homogeneous solder joints.

Technical properties

• Composition: Sn 63 %, Pb 37 %
• Melting point: 183 °C (eutectic)
• Grain size: T4 (20-38 µm)
• Particle morphology: Spherical, optimised for stencil printing
• Purity: High quality, controlled oxidation

Sustainability & regulation

Sn63Pb37 is a leaded solder and therefore not RoHS-compliant. It is still used in Speciality and industrial sectors where the advantages of eutectic alloys are indispensable. NMD only supplies this powder to authorised fields of application.

Conclusion

Sn63Pb37 T4 solder powder is the fine-grain version of the proven eutectic standard solder. With a melting point of 183 °C, high reproducibility and T4 grain size, it is ideal for fine-pitch, SMT and high-density assemblies. Further fields of application can be found in the Semiconductor Technology & Electronics and in the Hard & soft soldering.