Sn95.5Ag3.8 Cu0.7 T3 Solder powder

The Sn95.5Ag3.8Cu0.7 T3 solder powder is a SAC Lot with a balanced composition of 95.5 % Tin, 3.8 % Silver and 0.7 % Copper. The reduced silver content makes it more economical than classic SAC305 alloys, while the increased copper content improves resistance to thermal cycling. With a T3 grit (25-45 µm) it is suitable for clean stencil prints, homogeneous paste rheology and reliable solder joints in SMT and reflow processes.

Properties and advantages

• Cost-efficient: Less silver content reduces material costs without loss of quality.
• Increased copper content (0.7 %): Improves thermal cycle stability and reliability of solder joints.
• T3 grit: Good balance between printability, wetting and flow behaviour.
• High wettability: Produces clean, even solder joints even with complex layouts.
• Lead-free & RoHS compliant: Sustainable solution for modern electronics production.

Areas of application

SMT and reflow processes

In the Semiconductor Technology & Electronics Sn95.5Ag3.8Cu0.7 is a standard for SMT soldering and reflow processes that require durable solder joints.

Fine-Pitch & BGA

Thanks to the T3 grit the powder is suitable for Fine pitch layouts and for BGA and µBGA componentsthat require precise solder pastes with stable reflow performance.

Automotive industry & electrical engineering

In the Automotive industry and Electrical engineering Sn95.5Ag3.8Cu0.7 is used for assemblies that have to withstand strong temperature fluctuations and vibrations.

Hard & soft soldering

Also in the area of Hard & soft soldering the powder is used when lead-free processes with robust solder joints are required.

Technical properties

• Composition: Sn 95.5 %, Ag 3.8 %, Cu 0.7 %
• Melting range: approx. 217-220 °C
• Grain size: T3 (25-45 µm)
• Particle morphology: Predominantly spherical for stable paste rheology
• Quality: Controlled purity, low oxidation

Sustainability & regulation

As Lead-free SAC solder Sn95.5Ag3.8Cu0.7 fulfils the RoHS requirements and its balanced composition makes it an internationally recognised standard in electronics production.

Conclusion

Sn95.5Ag3.8Cu0.7 T3 solder powder is an economical and reliable SAC alloy with an optimised balance between silver and copper content. It offers high thermal stability, precise processing and is the right choice for fine-pitch, BGA and demanding SMT applications. Further fields of application can be found in the following areas Semiconductor Technology & Electronics and in the Hard & soft soldering.