Sn95.5Ag3.8 Cu0.7 T4 Solder powder

The Sn95.5Ag3.8Cu0.7 T4 solder powder is a SAC Lot (tin-silver-copper), which offers a balanced combination of economy and reliability thanks to its reduced silver content and increased copper content. With 95.5 % Tin, 3.8 % Silver and 0.7 % Copper the alloy impresses with its high thermal cycle stability. The T4 grit (20-38 µm) makes this powder particularly suitable for high-density printed circuit boards, fine-pitch structures and BGA/µBGA applications.

Properties and advantages

• Cost-efficient: Reduced silver content lowers material costs compared to standard SAC305.
• Increased copper content (0.7 %): Improves resistance to thermal cycles and increases reliability.
• Fine T4 grit: Ideal for high-resolution stencil printing processes and miniature layouts.
• Very good wetting: Clean, even solder joints with a homogeneous microstructure.
• Lead-free & RoHS compliant: Environmentally friendly and internationally recognised standard solder.

Areas of application

Fine-Pitch & Micro-BGA

Thanks to the fine grain size, Sn95.5Ag3.8Cu0.7 T4 is perfect for High-density circuitsfine pitch layouts and for BGA and µBGA componentsthat require the highest precision. It is primarily used in the Semiconductor Technology & Electronics.

SMT and reflow processes

The T4 grit ensures precise stencil application and enables reproducible results in automated SMT and reflow soldering.

Automotive industry & electrical engineering

In the Automotive industry and Electrical engineering this SAC alloy is used when assemblies have to reliably withstand both vibrations and large temperature changes.

Hard & soft soldering

Also for applications in the Hard & soft soldering Sn95.5Ag3.8Cu0.7 T4 is suitable when lead-free processes with a defined microstructure are required.

Technical properties

• Composition: Sn 95.5 %, Ag 3.8 %, Cu 0.7 %
• Melting range: approx. 217-220 °C
• Grain size: T4 (20-38 µm)
• Particle morphology: Predominantly spherical for stable paste rheology
• Purity: High quality, low oxidation tendency

Sustainability & regulation

Sn95.5Ag3.8Cu0.7 T4 is lead-free and fulfils the RoHS specifications. It offers a sustainable solution for electronics production and supports precise, energy-efficient production processes.

Conclusion

Sn95.5Ag3.8Cu0.7 T4 solder powder is the right choice for high-precision fine-pitch, SMT and BGA applications. With its fine grain size, high cycle stability and lead-free composition, it offers maximum process reliability for modern electronics. Further fields of application can be found in the following areas Semiconductor Technology & Electronics and Hard & soft soldering.