Sn95.5Ag4Cu0.5 T3 solder powder

Sn95.5Ag4Cu0.5 T3 solder powder belongs to the group of SAC plumb bob (tin-silver-copper) and is a lead-free standard material for modern electronics production. With 95.5 % Tin, 4 % Silver and 0.5 % Copper this alloy combines excellent mechanical properties with high thermal and electrical conductivity. The T3 grit (25-45 µm) ensures clean stencil prints and stable solder joints in automated SMT and reflow processes.

Properties and advantages

• Optimised SAC alloy: Combination of tin, silver and copper for high mechanical strength and reliability.
• High wettability: Creates even, robust solder joints even with complex PCB layouts.
• T3 grit: Good balance of printability, wetting and low tendency to form solder beads.
• Thermal stability: Copper content improves thermal conductivity and resistance to temperature cycles.
• Lead-free & RoHS compliant: Fulfils international environmental standards.

Areas of application

SMT and reflow soldering

The powder is ideal for Semiconductor Technology & Electronics. The T3 grain size produces stable solder pastes with reproducible printing and reflow performance.

Fine-Pitch & BGA

Thanks to the fine powder structure, Sn95.5Ag4Cu0.5 is suitable for Fine pitch structures and BGA/µBGA components that require particularly precise sounding points.

Automotive industry & electrical engineering

In the Automotive industry and Electrical engineering this SAC alloy is used in control units, sensors and modules that are exposed to high temperatures and vibrations.

Hard & soft soldering

Also in the area of Hard & soft soldering Sn95.5Ag4Cu0.5 can be used when lead-free processes with stable solder joints are required.

Technical properties

• Composition: Sn 95.5 %, Ag 4 %, Cu 0.5 %
• Melting range: approx. 217-220 °C
• Grain size: T3 (25-45 µm)
• Particle morphology: spherical for stable paste rheology
• Purity: High quality, low oxidation

Sustainability & regulation

As Lead-free solder Sn95.5Ag4Cu0.5 fulfils the RoHS requirements and is an established standard in electronics production. It combines sustainability with high technical performance.

Conclusion

Sn95.5Ag4Cu0.5 T3 solder powder is a reliable, lead-free SAC solder with an excellent combination of strength, thermal conductivity and processability. It is suitable for fine-pitch, SMT, BGA and demanding applications in industry and electronics. Further information on fields of application can be found in the areas Semiconductor Technology & Electronics and Hard & soft soldering.