Sn95.5Ag4Cu0.5 T4 solder powder

The Sn95.5Ag4Cu0.5 T4 solder powder is a lead-free SAC Lot (tin-silver-copper), which is characterised by its T4 grit (20-38 µm) is particularly suitable for high-resolution PCB layouts. With 95.5 % Tin, 4 % Silver and 0.5 % Copper the alloy offers excellent mechanical properties, high wettability and stable solder joints at a melting range of approx. 217-220 °C. Compared to the T3 version, the finer grain size enables more precise paste deposition in demanding SMT and fine-pitch applications.

Properties and advantages

• Optimised SAC alloy: Tin-silver-copper combination for high strength and thermal stability.
• Fine T4 grit: Ideal for fine-pitch designs, micro-BGA and high-resolution circuits.
• Very good wetting: Homogeneous, durable solder joints even on complex assemblies.
• Thermal load capacity: Copper content improves thermal conductivity and cycle stability.
• Lead-free & RoHS compliant: Environmentally friendly and reliable alternative to Sn-Pb solders.

Areas of application

Fine-Pitch & Micro-BGA

The fine T4 grit supports precise paste deposits and reliable wetting with high-density circuitsfine-pitch layouts and micro-BGA applications in the Semiconductor Technology & Electronics.

SMT and reflow processes

In automated SMT and reflow soldering processes Sn95.5Ag4Cu0.5 T4 impresses with reproducible results, clean stencil prints and homogeneous solder joints.

Automotive industry & electrical engineering

In the Automotive industry and Electrical engineering the alloy is used for control units, sensors and power modules that have to withstand high temperature changes and vibrations.

Hard & soft soldering

Also in the Hard & soft soldering Sn95.5Ag4Cu0.5 T4 ensures process-reliable solder joints with a defined microstructure.

Technical properties

• Composition: Sn 95.5 %, Ag 4 %, Cu 0.5 %
• Melting range: approx. 217-220 °C
• Grain size: T4 (20-38 µm)
• Particle morphology: spherical for precise paste rheology
• Purity: High material quality, low oxidation

Sustainability & regulation

As Lead-free solder Sn95.5Ag4Cu0.5 fulfils the RoHS specifications and is an established standard in electronics production. The fine grain reduces reject rates and supports energy-efficient processes.

Conclusion

Sn95.5Ag4Cu0.5 T4 solder powder offers maximum precision for fine-pitch, BGA and high-density SMT layouts thanks to its fine grain size. The combination of mechanical stability, thermal resilience and lead-free composition makes it the ideal choice for modern electronics. Further areas of application can be found in the Semiconductor Technology & Electronics and in the Hard & soft soldering.