Sn95Sb0.5 T3 solder powder

Sn95Sb0.5 T3 solder powder is a lead-free tin-antimony solder made from 95 % Tin and 0.5 % Antimony consists of. The low addition of antimony gives the solder a Improved mechanical strength and increased resistance to thermal stress. With a melting range of approx. 232-240 °C, it is suitable for SMT and reflow applicationsthat require robust and reliable solder joints. The T3 grit (25-45 µm) ensures uniform paste rheology and precise stencil prints.

Properties and advantages

• Antimony reinforced: 0.5 % Sb increases the strength and temperature resistance of the solder joints.
• Stable melting range: Approx. 232-240 °C for reliable processing.
• T3 grit: Good balance between flow properties, printability and paste homogeneity.
• High wettability: Clean, even solder joints even with complex layouts.
• Lead-free & RoHS compliant: Sustainable alternative to classic tin-lead solders.

Areas of application

SMT and reflow processes

Sn95Sb0.5 T3 is used in the Semiconductor Technology & Electronics for SMT printed circuit boards and Reflow soldering where reliable, mechanically resilient solder joints are required.

Fine pitch applications

With its T3 grit the powder is also suitable for Fine pitch designsthat require reproducible paste rheology and precise deposits.

Automotive industry & electrical engineering

In the Automotive industry and in the Electrical engineering Sn95Sb0.5 T3 is used in assemblies that have to withstand high temperature cycles and mechanical vibrations.

Hard & soft soldering

Also in the area of Hard & soft soldering the powder is used when lead-free processes with increased mechanical strength are required.

Technical properties

• Composition: Sn 95 %, Sb 0.5 %
• Melting range: approx. 232-240 °C
• Grain size: T3 (25-45 µm)
• Particle morphology: Spherical for even paste distribution
• Purity: High quality, controlled oxidation

Sustainability & regulation

Sn95Sb0.5 is lead-free and fulfils the RoHS specifications. The antimony content makes it a sustainable alternative for applications that require lead-free, but at the same time resilient solder joints.

Conclusion

Sn95Sb0.5 T3 solder powder combines lead-free composition with improved mechanical stability. With T3 grain size, high process reliability and reliable wetting, it is an ideal choice for SMT, fine-pitch and industrial applications. Further fields of application can be found in the Semiconductor Technology & Electronics and in the Hard & soft soldering.