Sn96.5Ag3.5 T3 solder powder

The Sn96.5Ag3.5 T3 solder powder is a lead-free eutectic solder with a defined melting point of approx. 221 °C. Through the Silver content of 3.5 % it offers high mechanical stability, very good wetting and reliable processing. The T3 grit (typ. 25-45 µm) is designed for precise solder pastes and reproducible SMT processes and is ideally suited for applications in the Semiconductor Technology & Electronics.

Properties and advantages

• Lead-free eutectic: Constant melting temperature (~221 °C) for homogeneous, reproducible solder joints.
• Silver reinforcement (3.5 % Ag): Increases the strength and reliability of soldered joints, even with thermal cycles.
• T3 grit (25-45 µm): Balanced printability, defined paste deposit and low tendency to solder beads.
• Very good wettability: Clean, even solder joints with stable connection to pads and connections.
• Process reliability: Suitable for automated reflow processes and fine pitch layouts.

Areas of application

SMT, Fine-Pitch & BGA

The T3 grit supports precise stencil printing performance, controlled wetting and stable reflow results - ideal for fine-pitch structures and BGA/µBGA assemblies in the stencil printing process. Semiconductor Technology & Electronics.

Printed circuit board production

In series production, the alloy impresses with its consistent melting properties, homogeneous solder joints and reliable electrical contact quality on dense PCB layouts.

Hard & soft soldering

For defined, lead-free processes in the Hard & soft soldering Sn96.5Ag3.5 is suitable for soldering thanks to its reliable flow and wetting properties and robust solder joint microstructure.

Automotive industry & electrical engineering

In the Automotive industry and the Electrical engineering the alloy is used when assemblies have to withstand vibrations and temperature changes permanently.

Technical properties

• Composition: Sn 96.5 %, Ag 3.5 %
• Melting point: approx. 221 °C (eutectic)
• Grain size: T3 (typically 25-45 µm)
• Particle morphology: Predominantly spherical for even distribution and stable paste rheology
• Quality: Controlled purity to minimise oxidation and slag formation

Sustainability & regulation

As lead-free Sn96.5Ag3.5 alloy generally fulfils common RoHS requirements and is therefore ideally suited as a standard solder in electronics production. Other lead-free and lead-containing alloys are also available for applications with special requirement profiles.

Conclusion

Sn96.5Ag3.5 T3 solder powder is a proven, lead-free eutectic with a constant melting temperature, very good wetting and high solder joint strength. Thanks to its T3 grain size, it is the reliable choice for precise solder pastes, fine-pitch layouts and automated SMT processes. Further related fields of application can be found in the following areas Semiconductor Technology & Electronics and Hard & soft soldering.