Sn96.5Ag3Cu0.5 T3 solder powder

Sn96.5Ag3Cu0.5 T3 solder powder is one of the most frequently used internationally SAC alloys and is used as standard in electronics production. With 96.5 % Tin, 3 % Silver and 0.5 % Copper it offers a balanced ratio of reliability, mechanical stability and thermal resistance. The melting range is approx. 217-220 °C. Thanks to the T3 grit (25-45 µm) the powder is ideal for reproducible stencil printing and reliable reflow soldering.

Properties and advantages

• Proven standard alloy: SAC305 is established worldwide and approved in many industries.
• High solder joint strength: Reliable performance even under thermal cycles and mechanical stress.
• T3 grit: Balanced printability and even paste distribution.
• Very good wetting: Homogeneous and durable solder joints, even with fine-pitch assemblies.
• Lead-free & RoHS compliant: Sustainable solution for modern electronics production.

Areas of application

SMT and reflow soldering

Sn96.5Ag3Cu0.5 T3 is mainly used in the Semiconductor Technology & Electronics used. The T3 grit enables precise stencil application and stable reflow results.

Fine-Pitch & BGA

Particularly suitable for Fine pitch layouts and BGA and µBGA componentswhere precise solder pastes are crucial.

Automotive industry & electrical engineering

In the Automotive industry and the Electrical engineering SAC305 is used when assemblies have to reliably withstand high temperatures and vibrations.

Hard & soft soldering

Also in the Hard & soft soldering Sn96.5Ag3Cu0.5 is used when lead-free processes with defined melting ranges are required.

Technical properties

• Composition: Sn 96.5 %, Ag 3 %, Cu 0.5 %
• Melting range: approx. 217-220 °C
• Grain size: T3 (25-45 µm)
• Particle morphology: Spherical for uniform paste rheology
• Purity: Controlled quality with low oxidation

Sustainability & regulation

As Lead-free solder Sn96.5Ag3Cu0.5 fulfils the RoHS requirements and is a globally recognised standard for electronics production. It supports energy-efficient manufacturing processes and reduces the ecological footprint.

Conclusion

Sn96.5Ag3Cu0.5 T3 solder powder is a proven standard for SMT, reflow and fine-pitch applications. It combines reliability, mechanical stability and lead-free composition to make it a safe choice for modern electronics production. Further fields of application can be found in the following areas Semiconductor Technology & Electronics and Hard & soft soldering.