Sn96.5Ag3Cu0.5 T4 solder powder

Sn96.5Ag3Cu0.5 T4 solder powder is the finer version of the globally established SAC305-Lots. With 96.5 % Tin, 3 % Silver and 0.5 % Copper it combines high reliability with process-safe behaviour in the SMT and reflow soldering. The T4 grit (20-38 µm) ensures more precise paste deposition and is particularly suitable for fine-pitch and micro-BGA applications. The melting range is approx. 217-220 °C.

Properties and advantages

• Fine grain T4: Supports high-resolution layouts, stencil printing with small openings and micro-BGA solder joints.
• Proven SAC305 alloy: International standard for lead-free soldering with stable performance.
• High process stability: Reproducible results in the automated SMT and reflow process.
• Very good wetting: Ensures even, homogeneous solder joints with high reliability.
• Lead-free & RoHS compliant: Fulfils international standards for sustainable electronics production.

Areas of application

Fine-Pitch & Micro-BGA

With its fine T4 grit Sn96.5Ag3Cu0.5 is excellently suited for High-density PCB layoutsfine pitch designs and BGA/µBGA components in the Semiconductor Technology & Electronics.

SMT and reflow processes

In automated SMT and reflow soldering the powder offers reproducible results and clean stencil prints with defined paste rheology.

Automotive industry & electrical engineering

In the Automotive industry and the Electrical engineering SAC305 is used when assemblies have to withstand temperature cycles and vibrations permanently.

Hard & soft soldering

Also in the area of Hard & soft soldering Sn96.5Ag3Cu0.5 T4 convinces with defined melting points and durable compounds.

Technical properties

• Composition: Sn 96.5 %, Ag 3 %, Cu 0.5 %
• Melting range: approx. 217-220 °C
• Grain size: T4 (20-38 µm)
• Particle morphology: Spherical for even paste distribution
• Purity: High quality, low oxidation tendency

Sustainability & regulation

Sn96.5Ag3Cu0.5 T4 is a Lead-free solderfulfils the RoHS specifications and is recognised worldwide as the standard in electronics production. The fine grain also contributes to efficiency in production.

Conclusion

Sn96.5Ag3Cu0.5 T4 solder powder is the right choice for high-precision applications such as fine-pitch and micro-BGA. With its fine grain, proven SAC305 composition and lead-free design, it stands for reliability and process safety in modern electronics production. Further fields of application can be found in the following areas Semiconductor Technology & Electronics and Hard & soft soldering.