Sn96.5Ag3Cu0.5 T5 solder powder

Sn96.5Ag3Cu0.5 T5 solder powder is the T5 variant of the established SAC305-Lots. With 96.5 % Tin, 3 % Silver and 0.5 % Copper it offers high reliability, thermal stability and excellent mechanical properties. The Very fine grain size (15-25 µm) makes it ideal for high-density circuits, fine-pitch designs and Micro-BGAwhere maximum precision is required.

Properties and advantages

• Very fine grain T5: Specially developed for high-resolution stencil openings, micro BGA and miniature layouts.
• Proven SAC305 alloy: Established global standard for lead-free electronics production.
• High reliability: Stable solder joints even under temperature cycles and mechanical stress.
• Excellent wettability: Homogeneous, reproducible solder joints in demanding SMT processes.
• Lead-free & RoHS compliant: Sustainable solution for modern electronics production.

Areas of application

Fine-Pitch & Micro-BGA

With its T5 grit Sn96.5Ag3Cu0.5 is ideal for Micro-BGA, CSP and fine-pitch layouts that require precise solder pastes with minimal bridging. The main area of application is Semiconductor Technology & Electronics.

SMT and reflow processes

In SMT and reflow soldering the powder enables precise stencil placement and delivers reproducible results for highly integrated assemblies.

Automotive industry & electrical engineering

In the Automotive industry and Electrical engineering SAC305 T5 is used when miniaturised assemblies require high load capacity and reliability at the same time.

Hard & soft soldering

Also in the area of Hard & soft soldering Sn96.5Ag3Cu0.5 T5 can be used when lead-free solutions with a very fine grain size are required.

Technical properties

• Composition: Sn 96.5 %, Ag 3 %, Cu 0.5 %
• Melting range: approx. 217-220 °C
• Grain size: T5 (15-25 µm)
• Particle morphology: Spherical for uniform paste rheology
• Purity: Controlled quality, low oxidation tendency

Sustainability & regulation

As Lead-free solder Sn96.5Ag3Cu0.5 T5 fulfils the RoHS specifications and is internationally recognised. The fine grain ensures more precise processes and reduces reject rates - an advantage for quality and the environment.

Conclusion

Sn96.5Ag3Cu0.5 T5 solder powder is the high-end version of the SAC305 series. With its very fine grain, lead-free composition and maximum precision, it is ideal for fine-pitch, micro-BGA and high-density SMT applications. Further fields of application can be found in the following areas Semiconductor Technology & Electronics and in the Hard & soft soldering.