Sn96Ag4 T3 solder powder

The Sn96Ag4 T3 solder powder is a lead-free tin-silver alloy with a 4 % Ag for high mechanical stability and excellent wetting. The T3 grit (typically 25-45 µm) is designed for precise solder pastes, stable stencil printing processes and reproducible reflow results in the Semiconductor Technology & Electronics designed. The melting range is typically in the area of approx. 221-225 °C.

Properties and advantages

• Lead-free alloy: Suitable as a RoHS-compliant alternative to Sn-Pb solders.
• High silver content (4 % Ag): Increases the strength and reliability of solder joints, even under temperature changes.
• T3 grit (25-45 µm): Balanced printability, defined paste deposit and low solder bead formation.
• Very good wetting: Clean, even solder joints with stable connection to pads and connections.
• Process reliability: Optimised for automated SMT & reflow processes and fine pitch layouts.

Areas of application

SMT, Fine-Pitch & BGA

The T3 grit supports precise stencil placement, controlled wetting and stable reflow results - ideal for fine-pitch structures and BGA/µBGA assemblies in the Semiconductor Technology & Electronics.

Printed circuit board production

In series production, Sn96Ag4 impresses with its homogeneous solder joints, defined melting properties and reliable electrical contact quality on dense PCB layouts.

Hard & soft soldering

For clearly defined, lead-free processes in the Hard & soft soldering Sn96Ag4 offers a robust solder joint microstructure and reliable flow properties.

Automotive industry & electrical engineering

In the Automotive industry and the Electrical engineering the alloy is used where assemblies have to withstand vibrations and temperature cycles on a permanent basis.

Technical properties

• Composition: Sn 96 %, Ag 4 %
• Melting range: approx. 221-225 °C
• Grain size: T3 (typically 25-45 µm)
• Particle morphology: Predominantly spherical for even distribution & stable paste rheology
• Quality: Controlled purity to minimise oxidation and slag formation

Sustainability & regulation

As lead-free Sn96Ag4 alloy generally fulfils common RoHS requirements and is therefore ideally suited as a standard solder in modern electronics production. Other lead-free and lead-containing alloys are also available for applications with special profiles.

Conclusion

Sn96Ag4 T3 solder powder combines high solder joint strength thanks to 4 % silver with a process-safe T3 grain - ideal for fine-pitch layouts, BGA/µBGA and automated SMT processes. Related fields of application can be found in the following areas Semiconductor Technology & Electronics and Hard & soft soldering.