Sn96Ag4 T4 solder powder

Sn96Ag4 T4 solder powder is a lead-free tin-silver alloy with a 4 % Silvercharacterised by a particularly fine T4 grit (20-38 µm) characterised. Compared to the T3 variant, T4 enables a more precise paste application and optimised wetting for high-density circuits. With a melting range of approx. 221-225 °C, it offers the perfect balance between process reliability and mechanical strength - ideal for the modern Semiconductor Technology & Electronics.

Properties and advantages

• Very fine grain (T4): Ideal for high-resolution PCB layouts, fine pitch pads and micro BGA components.
• High silver content (4 %): Ensures stable, robust and durable solder joints, even with temperature changes.
• Lead-free and RoHS-compliant: Fulfils current environmental requirements for electronics production.
• Even wetting: Produces clean, homogeneous solder joints without cavities.
• Process-optimised: Consistent melting properties for automated SMT processes.

Areas of application

Fine-Pitch & Micro-BGA

The fine T4 grain makes Sn96Ag4 particularly suitable for High-density assemblieswhere the smallest solder joints need to be positioned precisely. It enables precise solder pastes and minimises the risk of bridging.

Printed circuit board production

In the Semiconductor Technology & Electronics the alloy impresses with its reliable solder joints, which are required for highly integrated circuits and miniaturisation.

Hard & soft soldering

For lead-free processes in the Hard & soft soldering Sn96Ag4 T4 offers stable solder joints with high corrosion resistance and a defined microstructure.

Automotive industry & electrical engineering

In the Automotive industry and Electrical engineering Sn96Ag4 T4 is used when control units, sensors and assemblies have to withstand permanent vibrations and temperature cycles.

Technical properties

• Composition: Sn 96 %, Ag 4 %
• Melting range: approx. 221-225 °C
• Grain size: T4 (20-38 µm)
• Particle morphology: Predominantly spherical for even distribution
• Quality: High purity, low oxidation

Sustainability & regulation

As Lead-free alternative Sn96Ag4 T4 fulfils the RoHS requirements and supports sustainable production processes. It enables companies to meet the increasing demands for environmental friendliness without compromising on quality and performance.

Conclusion

Sn96Ag4 T4 solder powder is the ideal choice for fine-pitch, micro-BGA and high-density circuit designs. With its fine grit, it offers maximum precision, reliable solder joints and a lead-free solution for demanding applications. Discover further possible applications in the following areas Semiconductor Technology & Electronics and Hard & soft soldering.