Sn99Ag0.3Cu0.7 T3 solder powder

Sn99Ag0.3Cu0.7 T3 solder powder belongs to the group of lead-free SAC alloys (tin-silver-copper) and is particularly economical due to its low silver content. With 99 % Tin, 0.3 % Silver and 0.7 % Copper it offers a good balance between cost, processability and reliability. The melting range is approx. 217-220 °C. Thanks to the T3 grit (25-45 µm) it is ideal for stable stencil prints and uniform reflow solder joints.

Properties and advantages

• Economic alternative: Low silver content reduces material costs while maintaining the same quality.
• Stable solder joints: Copper ensures improved thermal conductivity and mechanical strength.
• T3 grit: Suitable for standard SMT processes with clean paste rheology.
• Very good wetting: Homogeneous solder joints even with complex PCB layouts.
• Lead-free & RoHS compliant: Meets international standards for sustainable electronics production.

Areas of application

SMT and reflow process

In the Semiconductor Technology & Electronics Sn99Ag0.3Cu0.7 T3 is a standard for SMT soldering and reflow processes that require reproducible results.

Fine-Pitch & BGA

The T3 grit allows precise stencil application for Fine pitch designs and for BGA and µBGA components.

Automotive industry & electrical engineering

In the Automotive industry and the Electrical engineering this alloy is used for assemblies that have to withstand cyclical loads caused by temperature changes.

Hard & soft soldering

Also for lead-free processes in the Hard & soft soldering Sn99Ag0.3Cu0.7 T3 is a proven solution with stable results.

Technical properties

• Composition: Sn 99 %, Ag 0.3 %, Cu 0.7 %
• Melting range: approx. 217-220 °C
• Grain size: T3 (25-45 µm)
• Particle morphology: Spherical for clean stencil printing
• Purity: High quality, controlled oxidation

Sustainability & regulation

Sn99Ag0.3Cu0.7 T3 is a Lead-free SAC solder and fulfils the RoHS specifications. As a widely used international alloy, it supports the switch to sustainable production processes.

Conclusion

Sn99Ag0.3Cu0.7 T3 solder powder is the ideal choice for companies looking for a cost-effective and reliable SAC solution. With T3 grain size, high wettability and proven stability, it is suitable for SMT, reflow, fine pitch and BGA. Further fields of application can be found in the following areas Semiconductor Technology & Electronics and Hard & soft soldering.