Sn99Ag0.3Cu0.7 T4 solder powder

Sn99Ag0.3Cu0.7 T4 solder powder is a lead-free SAC alloywhich is particularly economical due to its low silver content. With 99 % Tin, 0.3 % Silver and 0.7 % Copper it offers an excellent balance between cost, reliability and performance. The melting range is approx. 217-220 °C. The T4 grit (20-38 µm) is specially designed for high-resolution PCB layouts, fine-pitch designs and micro-BGA applications.

Properties and advantages

• Economical: Very low silver content ensures lower material costs with high quality.
• Fine T4 grit: Ideal for high-density circuits, precise stencil printing and fine paste applications.
• Thermal stability: The copper content improves thermal conductivity and resistance to temperature cycles.
• Very good wettability: Clean, homogeneous solder joints with high reliability.
• Lead-free & RoHS compliant: Sustainable solution for modern electronics production.

Areas of application

Fine-Pitch & Micro-BGA

The T4 grit supports high-precision paste deposits and is ideal for Fine pitch layouts and BGA/µBGA components in the Semiconductor Technology & Electronics.

SMT and reflow soldering

In automated SMT and reflow processes Sn99Ag0.3Cu0.7 T4 ensures reproducible results, precise print images and reliable solder joints.

Automotive industry & electrical engineering

In the Automotive industry and the Electrical engineering this alloy is used in modules and control units that have to withstand cyclical temperature loads.

Hard & soft soldering

Also in the Hard & soft soldering the powder delivers reliable, reproducible results in lead-free processes.

Technical properties

• Composition: Sn 99 %, Ag 0.3 %, Cu 0.7 %
• Melting range: approx. 217-220 °C
• Grain size: T4 (20-38 µm)
• Particle morphology: Predominantly spherical for clean paste rheology
• Purity: Controlled quality, low oxidation tendency

Sustainability & regulation

As Lead-free SAC solder Sn99Ag0.3Cu0.7 T4 fulfils the RoHS specifications and is an internationally established solution for lead-free electronics production. The fine grain reduces reject rates and increases process reliability.

Conclusion

Sn99Ag0.3Cu0.7 T4 solder powder combines cost-effectiveness with high technical performance. Thanks to its fine grain, it is suitable for demanding fine-pitch layouts, micro BGA and high-precision SMT applications. Further possible applications can be found in the following areas Semiconductor Technology & Electronics and in the Hard & soft soldering.