SnCu0.6Ni0.05Ge T3 solder powder

SnCu0.6Ni0.05Ge T3 solder powder is a lead-free, silver-free special solder, consisting of 99.35 % Tin, 0.6 % Copper, 0.05 % Nickel and a low Germanium additive. The nickel content improves the microstructure and reduces copper dissolution on printed circuit boards and pads. Germanium acts as an antioxidant and reduces oxide formation during the soldering process. With a melting point of approx. 227 °C and a T3 grit (25-45 µm) it provides a stable basis for SMT and reflow applications.

Properties and advantages

• Optimised alloy: Nickel stabilises the microstructure, germanium reduces oxidation.
• Silver-free & cost-efficient: Economical alternative to SAC alloys with similar reliability.
• Stable solder joints: High resistance to temperature cycles and mechanical loads.
• T3 grit: Ideal for standardised SMT processes with reproducible paste quality.
• Lead-free & RoHS compliant: Sustainable solution for modern electronics production.

Areas of application

SMT and reflow processes

Particularly suitable for SMT printed circuit boards and Reflow soldering in the Semiconductor Technology & Electronicswhere low-oxidation pastes and stable solder joints are required.

Fine pitch designs

Through the T3 grit SnCu0.6Ni0.05Ge is also suitable for fine-pitch structures that require clean paste applications.

Automotive industry & electrical engineering

In the Automotive industry and in the Electrical engineering the powder is used when lead-free, silver-free and at the same time robust solutions are required.

Hard & soft soldering

Also in the area of Hard & soft soldering SnCu0.6Ni0.05Ge can be used as it produces stable compounds with a defined microstructure.

Technical properties

• Composition: Sn ~99.35 %, Cu 0.6 %, Ni 0.05 %, Ge Trace element
• Melting point: approx. 227 °C
• Grain size: T3 (25-45 µm)
• Particle morphology: Spherical, low oxidation
• Purity: High quality thanks to controlled oxidation values

Sustainability & regulation

This plumb bob is lead-free and RoHS-compliant. The absence of silver makes it a cost-effective alternative, while germanium ensures greater process stability - an advantage for sustainable production.

Conclusion

SnCu0.6Ni0.05Ge T3 solder powder is a lead-free, silver-free special solder with optimised stability. Thanks to the addition of nickel and germanium, it offers low-oxidation processes, long-lasting solder joints and high cost-effectiveness. Further fields of application can be found in the Semiconductor Technology & Electronics and in the Hard & soft soldering.