Soldering powder for precise applications

Sn63Pb37 T5 solder powder

Soldering powder Sn63Pb37 from NMD Metalpowders
Illustration test sample
Item number: 7652

High purity Sn63Pb37 T5 solder powder with fine grain for reliable solder joints in electronics, PCB production and precision applications.

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Product description:

The Sn63Pb37 T5 solder powder is a classic eutectic solder powder that has been used in electronics production for decades. With its mixing ratio of 63 % tin (Sn) and 37 % lead (Pb), it offers a precisely defined melting point at 183 °C. The fine grain size according to T5 makes this soldering powder particularly suitable for applications where maximum precision is required.

Properties and advantages

  • Eutectic alloy: Melts and solidifies at a uniform temperature, resulting in homogeneous solder joints.
  • Fine grit (T5): Ideal for the production of Solder pasteswhich are used in high-resolution electronic processes such as fine-pitch and micro-BGA components.
  • High process stability: Consistent quality ensures reproducible results in automated production processes.
  • Wettability & flow behaviour: Excellent wetting properties ensure reliable and durable solder joints.

Applications of Sn63Pb37 T5

Printed circuit board production

One of the most widely used solder powders for the production of printed circuit boards. It offers precise results even with complex component designs and is the basis for reliable soldering. Semiconductor Technology & Electronics.

SMD and BGA assembly

Due to its fine grain size, it is suitable for the production of solder pastes that are used in the Surface Mount Technology (SMT) and with Ball Grid Array (BGA)-components.

Hard and soft soldering

Sn63Pb37 T5 is also used as a tried and tested material in the Hard and soft soldering where reproducible solder joints and controlled melting properties are crucial.

Automotive industry & electrical engineering

Also in the Automotive industry and in the Electrical engineering Sn63Pb37 T5 is used - especially for high-precision electronic components and assemblies.

Technical properties (example values, customisable according to specification)

  • Composition: Sn 63 %, Pb 37 %
  • Melting point: 183 °C (eutectic)
  • Grain size: T5 (15-25 µm)
  • Purity: High material purity to minimise oxidation
  • Mould: Spherical particle structure for even distribution

Sustainability & regulation

Although leaded solders such as Sn63Pb37 have been replaced by RoHS regulations in many electronics sectors, they are still indispensable in certain high-tech and specialised applications. Especially in the Aerospace or in special medical technologies, leaded solders may continue to be used due to their unique properties.

Conclusion

With Sn63Pb37 T5 solder powder you can rely on a proven material for high-precision soldering processes. The fine grain size ensures uniform solder pastes, perfect solder joints and reliable connections even in the most demanding applications. Rely on NMD Metal Powders as your partner for the reliable procurement of solder powders of proven quality. Please also visit our overview of Metal powder application areasto discover further possible applications.

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Expertise sinceover 25 years

Satisfied customersOver 305

Metal powder in 2023197,358 kg

Procurement for51 Industries

customer service

Do you have any questions?

Contact us for individual advice or our customer service on weekdays from 09:00 to 16:00.