Sn0.5Pb92.5Ag2.5 T4 solder powder

The Sn0.5Pb92.5Ag2.5 T4 solder powder is a lead-containing special alloy with a particularly high Lead content (92.5 %)supplemented by 0.5 % Tin and 2.5 % Silver. The T4 grit supports a fine paste application and stable printing results in demanding SMT processes as well as in the Hard & soft soldering.

Properties and advantages

• High lead content: Very good heat and stress resistance for long-lasting soldered joints.
• Silver reinforcement (2.5 % Ag): Increases the mechanical strength and improves the electrical contact quality.
• T4 grain size (typically 20-38 µm): Clean stencil prints, homogeneous paste distribution and controlled wetting.
• Constant melting range: Typically approx. 300-305 °C for reproducible results.
• Process stability: Suitable for automated reflow processes with uniform solder joint quality.

Areas of application

Electronics manufacturing (semiconductor technology & electronics)

In the Semiconductor Technology & Electronics the alloy proves its worth in assemblies that have to withstand high thermal cycles and vibrations.

SMD/SMT processes

The T4 grit is ideal for fine-pitch layouts and reliably printable solder pastes with stable paste rheology and controlled wetting.

Hard & soft soldering

In the area Hard & soft soldering the powder provides homogeneous solder joints with high resistance to temperature changes.

Automotive industry & electrical engineering

In the Automotive industry and the Electrical engineering the alloy is used in assemblies that are permanently exposed to mechanical and thermal loads.

Specialised applications

Thanks to its high stability against stress cracking and thermal cycles, the powder is also suitable for Pyrotechnic applications and other safety-relevant processes that require defined material properties.

Technical properties

• Composition: Sn 0.5 %, Pb 92.5 %, Ag 2.5 %
• Melting range: approx. 300-305 °C
• Grain size: T4 (typically 20-38 µm)
• Particle morphology: Predominantly spherical for even distribution
• Quality: Controlled purity to minimise oxidation

Sustainability & regulation

Due to the lead content, the alloy is subject to regulatory restrictions (e.g. RoHS). However, it remains indispensable in selected high-tech areas, such as the Aerospace and in pyrotechnical special applications.

Conclusion

Sn0.5Pb92.5Ag2.5 T4 solder powder combines high temperature resistance and mechanical robustness with process-safe T4 grit. It is a reliable choice for demanding electronic assemblies, fine-pitch layouts and applications with stringent quality requirements. Further information on related fields of application can be found at Semiconductor Technology & Electronics and Hard & soft soldering.