The ultra-fine copper powder UF2 NMD Metalpowders is a metal powder designed for applications where fine particles, material quality and a defined particle size distribution are crucial. With a D50 particle size of 1.0–2.0 µm, with its spherical particles and high purity, it provides a basis for demanding industrial processes.
Copper is characterised by high electrical and thermal conductivity. In ultrafine powder form, it is particularly suitable for the development of conductive formulations, fine structures and functional coatings. The properties that can be achieved depend not only on the powder quality but also on the composition of the material system and the processing method.
Technical specifications
- Particle size (D50): 1.0–2.0 µm
- Particle size (D90): ≤ 6 µm
- Particle size (D100): ≤ 9 µm
- Grain shape: Spherical
- Purity: High purity; detailed chemical specification available on request
The D50 value describes the median of the particle size distribution. Together with D90 and D100, it enables a targeted assessment of the particle size distribution for the intended process. Dispersibility and the surface condition of the particles are also relevant for processing.
Applications
Additive manufacturing and 3D printing
For use in the additive manufacturing The properties of UF₂ must be tailored to the specific process. The ultra-fine grain size places particular demands on dosing, powder distribution and processing. Appropriate material and process design creates the conditions necessary for the production of complex geometries and fine structures.
Electronics and printed circuit boards
In the Semiconductors and electronics Ultrafine copper powders are used as the metallic component in conductive pastes and other formulations. UF2 is a suitable starting material for this purpose, for example in printed conductor structures and contact applications. In addition to purity, the oxide content, particle contact and further processing are particularly crucial for the electrical conductivity of the finished structure.
Precision components
In the manufacture of precision mechanical components, a defined particle size distribution supports targeted material and process development. UF₂ can be tested for selected powder metallurgy applications where fine structures and the conductivity of copper are required. The achievable tolerances and mechanical properties are determined by the entire manufacturing process.
Surface coatings
With its fine structure, UF₂ is more electrically and thermally conductive as a metallic component Surface coatings Interesting. Such coating systems are used in electronics and other industrial sectors. An even distribution of the powder within the respective formulation helps to ensure a homogeneous coating structure; the performance of the coating also depends on the binder and the processing method.
Advantages of the product
UF2 ultra-fine copper powder offers key properties for demanding manufacturing processes:
- Specified grain size: The D50, D90 and D100 make it easier to select the right model and tailor it to the intended process.
- Conductive material base: Copper offers high electrical and thermal conductivity for functional components and material systems.
- Spherical particles: A defined particle shape as the basis for the development of suitable formulations and processing methods.
- Efficient choice of materials: Using a powder grade that is suitable for the process can help to reduce scrap and material losses.
Conclusion
The ultra-fine copper powder UF2 combines a specific grain size with the electrical and thermal properties of copper.
NMD Metalpowders draws on its many years of industry experience and an international network of suppliers to support you with material selection and professional procurement.
Enquire about UF2 copper powder now – tailored to your application, specifications and required quantities.
