The ultrafine copper powders UF3 from NMD Metalpowders is intended for applications where a defined particle size distribution and high material quality are crucial. With a D50 particle size of 2.0–3.0 µm, with its spherical particles and high purity, UF₃ is a raw material for conductive formulations and selected industrial manufacturing processes.
Copper’s electrical and thermal conductivity make the powder particularly suitable for electronic applications and functional coatings. For additive manufacturing processes and precision components, its suitability is assessed on the basis of the relevant material and process requirements.
Technical specifications
- Particle size (D50): 2.0–3.0 µm
- Particle size (D90): ≤ 8 µm
- Particle size (D100): ≤ 12 µm
- Grain shape: Spherical
- Purity: High purity; detailed chemical specification available on request
The D50 value describes the median of the particle size distribution. Together with D90 and D100, it enables the specific particle size to be selected. For processing purposes, the flow behaviour, dispersibility and surface condition of the particles are also relevant.
Applications
Additive manufacturing
For the additive manufacturing Copper powder UF3 must be tailored to the process and plant being used. Its ultra-fine particle size places particular demands on dosing and uniform material distribution. A suitable powder and process design creates the conditions required for complex geometries and fine component structures.
Electronics
In the Semiconductors and electronics Ultrafine copper powders are used as a component in conductive pastes and other formulations. UF3 is of interest as a starting material for this purpose, for example in printed conductor structures and contact applications. The electrical conductivity of the finished structure depends, amongst other things, on the oxide content, the particle contacts and the subsequent processing.
Precision components
In the manufacture of precision mechanical components, a defined particle size distribution helps to tailor the raw material to the manufacturing process. UF₃ can be tested for selected powder metallurgy applications where fine structures and electrical or thermal conductivity are required. The achievable tolerances and mechanical properties are determined by shaping, compaction and further processing steps.
Coatings and surface finishing
The spherical UF₃ particles can act as a metallic component that is electrically and thermally conductive Surface coatings be used. A homogeneous distribution within the respective formulation promotes a uniform build-up of the coating. The properties of the finished coating also depend on the binder, the copper content and the application process.
Advantages of the product
The ultrafine copper powders UF3 offers key properties for demanding industrial applications:
- Defined particle size distribution: The D50, D90 and D100 make it easier to match your processing specifications.
- Conductive material base: Copper offers high electrical and thermal conductivity for functional material systems.
- High purity: Of interest for applications with specific requirements regarding chemical composition.
- Spherical particles: A defined particle shape for the development of tailored formulations and manufacturing processes.
Sustainability and efficiency
Using a powder grade suited to the process can help to reduce scrap and material losses. Selecting and dosing UF₃ in line with requirements promotes efficient use of materials. The savings that can be achieved depend on the manufacturing process, the quality requirements and the opportunities for reuse.
Conclusion
The ultrafine copper powders UF3 combines a specific grain size with the electrical and thermal properties of copper.
NMD Metalpowders draws on its many years of industry experience and an international network of suppliers to support you with material selection and professional procurement.
Enquire about UF3 copper powder now – tailored to your application, your specifications and the quantities required.
